PS-200 single target magnetron sputtering coater is mainlycomposed of vacuum chamber, magnetron target, rotating substrate frame, vacuum system, frame, electrical control, etc.It can be used to prepare conductive film, metal film, dielectricfilm, semiconductor film, insulating film, multilayer film and soon. The equipment structure is compact, the floor area is smallsuits the university laboratory and the Scientific ResearchInstitute.
Environmental requirements
- Power supply: AC220V, power ≥20KVA
- Independent ground wire: <3w, flat copper wire 210mm2 is recommended for connection from equipment toground wire
- Water supply: flow rate ≥10 l/min water temperature 0-25 °C
- Room temperature: < 30 °C
- Relative humidity: < 75%
- High purity argon
- Indoor non-corrosive flammable, explosive, toxic gases, no large dust
Magnetron Sputtering Coater
Technical Parameters
No. | Product Parameters | Technical Indicators |
1 | Vacuum chamber size(inner diameter x high) | 200 x200mm |
2 | Extreme vacuum | 2 x10-4 Pa |
3 | Restore the working vacuum | From the atmosphere to 8x10-4pa, ≤40min |
4 | Work vacuum | ≤6X10-1Pa |
5 | Boost rate | ≤8X10-1Pa/h |
6 | The rotation speed of the substrate frame | 2-20 rpm adjustable |
7 | Target-film distance | 80-120mm |
8 | Vacuum system | Molecular pump: FF63/80 Model 62L/s. Mechanical Pump: TRP-123L/s |
9 | Total power | 20KVA |
10 | Size of equipment floor space. | 800x800 |
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Application Fields
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